Chawla, J. S., Gstrein, F., O’Brien, K. P., Clarke, J. S., and Gall, D. Electron scattering at surfaces and grain boundaries in Cu thin films and wires. Physical Review B 84.23 Web. doi:10.1103/PhysRevB.84.235423.

Chawla, J. S., Gstrein, F., O’Brien, K. P., Clarke, J. S., & Gall, D. Electron scattering at surfaces and grain boundaries in Cu thin films and wires. Physical Review B, 84 (23). https://doi.org/10.1103/PhysRevB.84.235423

Chawla, J. S., Gstrein, F., O’Brien, K. P., Clarke, J. S., and Gall, D. "Electron scattering at surfaces and grain boundaries in Cu thin films and wires". Physical Review B 84 (23). United States: American Physical Society. https://doi.org/10.1103/PhysRevB.84.235423. https://par.nsf.gov/biblio/10002518.

@article{osti_10002518,
place = {United States}, title = {Electron scattering at surfaces and grain boundaries in Cu thin films and wires}, url = {https://par.nsf.gov/biblio/10002518}, DOI = {10.1103/PhysRevB.84.235423}, abstractNote = {Not Available}, journal = {Physical Review B}, volume = {84}, number = {23}, publisher = {American Physical Society}, author = {Chawla, J. S. and Gstrein, F. and O’Brien, K. P. and Clarke, J. S. and Gall, D.}, }