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Title: On twin density and resistivity of nanometric Cu thin films
Authors:
; ; ; ; ; ; ; ;
Publication Date:
NSF-PAR ID:
10018542
Journal Name:
Journal of Applied Physics
Volume:
120
Issue:
6
Page Range or eLocation-ID:
065106
ISSN:
0021-8979
Publisher:
American Institute of Physics
Sponsoring Org:
National Science Foundation
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