Mello, Alberto W., Nicolas, Andrea, and Sangid, Michael D. Fatigue strain mapping via digital image correlation for Ni-based superalloys: The role of thermal activation on cube slip. Retrieved from https://par.nsf.gov/biblio/10026073. Materials Science and Engineering: A 695.C Web. doi:10.1016/j.msea.2017.04.002.

Mello, Alberto W., Nicolas, Andrea, & Sangid, Michael D. Fatigue strain mapping via digital image correlation for Ni-based superalloys: The role of thermal activation on cube slip. Materials Science and Engineering: A, 695 (C). Retrieved from https://par.nsf.gov/biblio/10026073. https://doi.org/10.1016/j.msea.2017.04.002

Mello, Alberto W., Nicolas, Andrea, and Sangid, Michael D. "Fatigue strain mapping via digital image correlation for Ni-based superalloys: The role of thermal activation on cube slip". Materials Science and Engineering: A 695 (C). Country unknown/Code not available. https://doi.org/10.1016/j.msea.2017.04.002. https://par.nsf.gov/biblio/10026073.

@article{osti_10026073,
place = {Country unknown/Code not available}, title = {Fatigue strain mapping via digital image correlation for Ni-based superalloys: The role of thermal activation on cube slip}, url = {https://par.nsf.gov/biblio/10026073}, DOI = {10.1016/j.msea.2017.04.002}, abstractNote = {}, journal = {Materials Science and Engineering: A}, volume = {695}, number = {C}, author = {Mello, Alberto W. and Nicolas, Andrea and Sangid, Michael D.}, }