Potential Pulse Atomic Layer Deposition of Cu 2 Se
- Award ID(s):
- 1410109
- PAR ID:
- 10033436
- Date Published:
- Journal Name:
- Chemistry of Materials
- Volume:
- 28
- Issue:
- 2
- ISSN:
- 0897-4756
- Page Range / eLocation ID:
- 583 to 591
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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