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Title: In situ imaging of the soldering reactions in nanoscale Cu/Sn/Cu and Sn/Cu/Sn diffusion couples
Authors:
 ;  ;  ;  ;  ;  
Publication Date:
NSF-PAR ID:
10049174
Journal Name:
Journal of Applied Physics
Volume:
123
Issue:
2
Page Range or eLocation-ID:
024302
ISSN:
0021-8979
Publisher:
American Institute of Physics
Sponsoring Org:
National Science Foundation
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