Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, and Povolotskyi, Michael. Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network. Physical Review Applied 9.4 Web. doi:10.1103/PhysRevApplied.9.044005.

Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, & Povolotskyi, Michael. Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network. Physical Review Applied, 9 (4). https://doi.org/10.1103/PhysRevApplied.9.044005

Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, and Povolotskyi, Michael. "Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network". Physical Review Applied 9 (4). United States: American Physical Society. https://doi.org/10.1103/PhysRevApplied.9.044005. https://par.nsf.gov/biblio/10056025.

@article{osti_10056025,
place = {United States}, title = {Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network}, url = {https://par.nsf.gov/biblio/10056025}, DOI = {10.1103/PhysRevApplied.9.044005}, abstractNote = {Not Available}, journal = {Physical Review Applied}, volume = {9}, number = {4}, publisher = {American Physical Society}, author = {Valencia, Daniel and Wilson, Evan and Jiang, Zhengping and Valencia-Zapata, Gustavo A. and Wang, Kuang-Chung and Klimeck, Gerhard and Povolotskyi, Michael}, }