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Title: A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
Award ID(s):
1740271
NSF-PAR ID:
10058392
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
AIP Advances
Volume:
8
Issue:
5
ISSN:
2158-3226
Page Range / eLocation ID:
055127
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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