A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
- Award ID(s):
- 1740271
- PAR ID:
- 10058392
- Date Published:
- Journal Name:
- AIP Advances
- Volume:
- 8
- Issue:
- 5
- ISSN:
- 2158-3226
- Page Range / eLocation ID:
- 055127
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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