Microwave metamaterials made by fused deposition 3D printing of a highly conductive copper-based filament
- Award ID(s):
- 1721644
- PAR ID:
- 10061971
- Date Published:
- Journal Name:
- Applied Physics Letters
- Volume:
- 110
- Issue:
- 18
- ISSN:
- 0003-6951
- Page Range / eLocation ID:
- 181903
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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