Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon (Conference Paper) | NSF PAGES

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Citation Details

Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon

Award ID(s):: 1716352

NSF-PAR ID:: 10074697

Author(s) / Creator(s):: Eris, Furkan; Joshi, Ajay; Kahng, Andrew B.; Ma, Yenai; Mojumder, Saiful; Zhang, Tiansheng

Date Published:: 2018-03-01

Journal Name:: Design, Automation and Test in Europe (DATE)

Page Range / eLocation ID:: 1441 to 1446

Format(s):: Medium: X

Sponsoring Org:: National Science Foundation

Free Publicly Accessible Full Text
Accepted Manuscript1.0
Conference Paper:
https://doi.org/10.23919/DATE.2018.8342238