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Title: Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon
Award ID(s):
1716352
PAR ID:
10074697
Author(s) / Creator(s):
; ; ; ; ;
Date Published:
Journal Name:
Design, Automation and Test in Europe (DATE)
Page Range / eLocation ID:
1441 to 1446
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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