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Title: Effects of Impurity Elements on Isothermal Grain Growth of Electroplated Copper
Award ID(s):
1662332
NSF-PAR ID:
10093021
Author(s) / Creator(s):
Date Published:
Journal Name:
Journal of The Electrochemical Society
Volume:
165
Issue:
7
ISSN:
0013-4651
Page Range / eLocation ID:
D251 to D257
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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