Thermal Atomic Layer Etching of Copper by Sequential Steps Involving Oxidation and Exposure to Hexafluoroacetylacetone
- Award ID(s):
- 1665191
- PAR ID:
- 10097542
- Date Published:
- Journal Name:
- ECS Journal of Solid State Science and Technology
- Volume:
- 7
- Issue:
- 9
- ISSN:
- 2162-8769
- Page Range / eLocation ID:
- P491 to P495
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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