Cui, Jin, Wang, Jicheng, Zhong, Yang, Pan, Liang, and Weibel, Justin A. Metallized compliant 3D microstructures for dry contact thermal conductance enhancement. Retrieved from https://par.nsf.gov/biblio/10105405. Journal of Micromechanics and Microengineering 28.5 Web. doi:10.1088/1361-6439/aaaf2e.

Cui, Jin, Wang, Jicheng, Zhong, Yang, Pan, Liang, & Weibel, Justin A. Metallized compliant 3D microstructures for dry contact thermal conductance enhancement. Journal of Micromechanics and Microengineering, 28 (5). Retrieved from https://par.nsf.gov/biblio/10105405. https://doi.org/10.1088/1361-6439/aaaf2e

Cui, Jin, Wang, Jicheng, Zhong, Yang, Pan, Liang, and Weibel, Justin A. "Metallized compliant 3D microstructures for dry contact thermal conductance enhancement". Journal of Micromechanics and Microengineering 28 (5). Country unknown/Code not available. https://doi.org/10.1088/1361-6439/aaaf2e. https://par.nsf.gov/biblio/10105405.

@article{osti_10105405,
place = {Country unknown/Code not available}, title = {Metallized compliant 3D microstructures for dry contact thermal conductance enhancement}, url = {https://par.nsf.gov/biblio/10105405}, DOI = {10.1088/1361-6439/aaaf2e}, abstractNote = {}, journal = {Journal of Micromechanics and Microengineering}, volume = {28}, number = {5}, author = {Cui, Jin and Wang, Jicheng and Zhong, Yang and Pan, Liang and Weibel, Justin A}, }