Wafer-Scale Hierarchically Textured Silicon for Surface Cooling
- Award ID(s):
- 1807825
- PAR ID:
- 10107563
- Date Published:
- Journal Name:
- 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
- Page Range / eLocation ID:
- 857 to 862
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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