Ultralow thermal conductivity in a two-dimensional material due to surface-enhanced resonant bonding
- Award ID(s):
- 1725797
- NSF-PAR ID:
- 10108429
- Date Published:
- Journal Name:
- Materials Today Physics
- Volume:
- 7
- Issue:
- C
- ISSN:
- 2542-5293
- Page Range / eLocation ID:
- 89 to 95
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1016/j.mtphys.2018.11.005
