Thermal transport in model copper-polyethylene interfaces
- Award ID(s):
- 1665367
- NSF-PAR ID:
- 10123494
- Publisher / Repository:
- American Institute of Physics
- Date Published:
- Journal Name:
- The Journal of Chemical Physics
- Volume:
- 151
- Issue:
- 17
- ISSN:
- 0021-9606
- Page Range / eLocation ID:
- Article No. 174708
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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