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Title: Thermal atomic layer etching of metallic tungsten via oxidation and etch reaction mechanism using O 2 or O 3 for oxidation and WCl 6 as the chlorinating etchant
Award ID(s):
1704151
PAR ID:
10132235
Author(s) / Creator(s):
 ;  
Publisher / Repository:
American Vacuum Society
Date Published:
Journal Name:
Journal of Vacuum Science & Technology A
Volume:
38
Issue:
2
ISSN:
0734-2101
Page Range / eLocation ID:
Article No. 022605
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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