Thermal atomic layer etching of metallic tungsten via oxidation and etch reaction mechanism using O 2 or O 3 for oxidation and WCl 6 as the chlorinating etchant
- Award ID(s):
- 1704151
- PAR ID:
- 10132235
- Publisher / Repository:
- American Vacuum Society
- Date Published:
- Journal Name:
- Journal of Vacuum Science & Technology A
- Volume:
- 38
- Issue:
- 2
- ISSN:
- 0734-2101
- Page Range / eLocation ID:
- Article No. 022605
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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