Interdependence of Electronic and Thermal Transport in Al x Ga 1–x N Channel HEMTs
- PAR ID:
- 10138758
- Author(s) / Creator(s):
- ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; more »
- Date Published:
- Journal Name:
- IEEE Electron Device Letters
- Volume:
- 41
- Issue:
- 3
- ISSN:
- 0741-3106
- Page Range / eLocation ID:
- 461 to 464
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation