The rapid progress of droplet microfluidics and its wide range of applications have created a high demand for the mass fabrication of low-cost, high throughput droplet generator chips aiding both biomedical research and commercial usage. Existing polymer or glass based droplet generators have failed to successfully meet this demand which generates the need for the development of an alternate prototyping technique. This work reports the design, fabrication and characterization of a mass manufacturable thermoplastic based microfluidic droplet generator on cyclic olefin copolymer (COC). COC chips with feature size as low as 20 µm have been efficiently fabricated using injection molding technology leading to a high production of inexpensive droplet generators. The novelty of this work lies in reoptimising surface treatment and solvent bonding methods to produce closed COC microchannels with sufficiently hydrophobic (contact angle of 120°) surfaces. These COC based droplet generators were shown to generate stable monodisperse droplets at a rate of 1300 droplets/second in the dripping regime. These new mass manufacturable, disposable and cheap COC droplet generators can be custom designed to cater to the rapidly increasing biomedical and clinical applications of droplet microfluidics.
Robust Microfabrication of Highly Parallelized Three-Dimensional Microfluidics on Silicon
We present a new, robust three dimensional microfabrication method for highly parallel microfluidics, to improve the throughput of on-chip material synthesis by allowing parallel and simultaneous operation of many replicate devices on a single chip. Recently, parallelized microfluidic chips fabricated in Silicon and glass have been developed to increase the throughput of microfluidic materials synthesis to an industrially relevant scale. These parallelized microfluidic chips require large arrays (>10,000) of Through Silicon Vias (TSVs) to deliver fluid from delivery channels to the parallelized devices. Ideally, these TSVs should have a small footprint to allow a high density of features to be packed into a single chip, have channels on both sides of the wafer, and at the same time minimize debris generation and wafer warping to enable permanent bonding of the device to glass. Because of these requirements and challenges, previous approaches cannot be easily applied to produce three dimensional microfluidic chips with a large array of TSVs. To address these issues, in this paper we report a fabrication strategy for the robust fabrication of three-dimensional Silicon microfluidic chips consisting of a dense array of TSVs, designed specifically for highly parallelized microfluidics. In particular, we have developed a two-layer TSV more »
- Publication Date:
- NSF-PAR ID:
- 10153652
- Journal Name:
- Scientific Reports
- Volume:
- 9
- Issue:
- 1
- ISSN:
- 2045-2322
- Publisher:
- Nature Publishing Group
- Sponsoring Org:
- National Science Foundation
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