Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Said, Mostafa, Reda, Sherief, Wang, Evelyn, and Coskun, Ayse K. Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips. Retrieved from https://par.nsf.gov/biblio/10167614. Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems . Web. doi:10.1109/ITHERM.2019.8757412.

Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Said, Mostafa, Reda, Sherief, Wang, Evelyn, & Coskun, Ayse K. Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips. Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, (). Retrieved from https://par.nsf.gov/biblio/10167614. https://doi.org/10.1109/ITHERM.2019.8757412

Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Said, Mostafa, Reda, Sherief, Wang, Evelyn, and Coskun, Ayse K. "Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips". Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (). Country unknown/Code not available. https://doi.org/10.1109/ITHERM.2019.8757412. https://par.nsf.gov/biblio/10167614.

@article{osti_10167614,
place = {Country unknown/Code not available}, title = {Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips}, url = {https://par.nsf.gov/biblio/10167614}, DOI = {10.1109/ITHERM.2019.8757412}, abstractNote = {}, journal = {Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems}, author = {Yuan, Zihao and Vaartstra, Geoffrey and Shukla, Prachi and Said, Mostafa and Reda, Sherief and Wang, Evelyn and Coskun, Ayse K.}, }