Mitigating early fracture of amorphous metallic thin films on flexible substrates by tuning substrate roughness and buffer layer properties
- Award ID(s):
- 1855651
- PAR ID:
- 10175508
- Date Published:
- Journal Name:
- Thin Solid Films
- Volume:
- 689
- Issue:
- C
- ISSN:
- 0040-6090
- Page Range / eLocation ID:
- 137493
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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