Kelly, Marion Branch, Niverty, Sridhar, and Chawla, Nikhilesh. Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints. Retrieved from https://par.nsf.gov/biblio/10176194. Acta Materialia 189.C Web. doi:10.1016/j.actamat.2020.02.052.

Kelly, Marion Branch, Niverty, Sridhar, & Chawla, Nikhilesh. Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints. Acta Materialia, 189 (C). Retrieved from https://par.nsf.gov/biblio/10176194. https://doi.org/10.1016/j.actamat.2020.02.052

Kelly, Marion Branch, Niverty, Sridhar, and Chawla, Nikhilesh. "Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints". Acta Materialia 189 (C). Country unknown/Code not available. https://doi.org/10.1016/j.actamat.2020.02.052. https://par.nsf.gov/biblio/10176194.

@article{osti_10176194,
place = {Country unknown/Code not available}, title = {Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints}, url = {https://par.nsf.gov/biblio/10176194}, DOI = {10.1016/j.actamat.2020.02.052}, abstractNote = {}, journal = {Acta Materialia}, volume = {189}, number = {C}, author = {Kelly, Marion Branch and Niverty, Sridhar and Chawla, Nikhilesh}, }