Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Reda, Sherief, Wang, Evelyn, and Coskun, Ayse K. Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers. Retrieved from https://par.nsf.gov/biblio/10195322. 2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) . Web. doi:10.1109/ISLPED.2019.8824965.

Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Reda, Sherief, Wang, Evelyn, & Coskun, Ayse K. Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers. 2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), (). Retrieved from https://par.nsf.gov/biblio/10195322. https://doi.org/10.1109/ISLPED.2019.8824965

Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Reda, Sherief, Wang, Evelyn, and Coskun, Ayse K. "Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers". 2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) (). Country unknown/Code not available. https://doi.org/10.1109/ISLPED.2019.8824965. https://par.nsf.gov/biblio/10195322.

@article{osti_10195322,
place = {Country unknown/Code not available}, title = {Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers}, url = {https://par.nsf.gov/biblio/10195322}, DOI = {10.1109/ISLPED.2019.8824965}, abstractNote = {}, journal = {2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)}, author = {Yuan, Zihao and Vaartstra, Geoffrey and Shukla, Prachi and Reda, Sherief and Wang, Evelyn and Coskun, Ayse K.}, }