Li, Jinghua, Li, Rui, Chiang, Chia‐Han, Zhong, Yishan, Shen, Haixu, Song, Enming, Hill, Mackenna, Won, Sang Min, Yu, Ki Jun, Baek, Janice Mihyun, Lee, Yujin, Viventi, Jonathan, Huang, Yonggang, and Rogers, John A. Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants. Retrieved from https://par.nsf.gov/biblio/10196410. Advanced Materials Technologies 5.1 Web. doi:10.1002/admt.201900800.

Li, Jinghua, Li, Rui, Chiang, Chia‐Han, Zhong, Yishan, Shen, Haixu, Song, Enming, Hill, Mackenna, Won, Sang Min, Yu, Ki Jun, Baek, Janice Mihyun, Lee, Yujin, Viventi, Jonathan, Huang, Yonggang, & Rogers, John A. Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants. Advanced Materials Technologies, 5 (1). Retrieved from https://par.nsf.gov/biblio/10196410. https://doi.org/10.1002/admt.201900800

Li, Jinghua, Li, Rui, Chiang, Chia‐Han, Zhong, Yishan, Shen, Haixu, Song, Enming, Hill, Mackenna, Won, Sang Min, Yu, Ki Jun, Baek, Janice Mihyun, Lee, Yujin, Viventi, Jonathan, Huang, Yonggang, and Rogers, John A. "Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants". Advanced Materials Technologies 5 (1). Country unknown/Code not available. https://doi.org/10.1002/admt.201900800. https://par.nsf.gov/biblio/10196410.

@article{osti_10196410,
place = {Country unknown/Code not available}, title = {Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants}, url = {https://par.nsf.gov/biblio/10196410}, DOI = {10.1002/admt.201900800}, abstractNote = {}, journal = {Advanced Materials Technologies}, volume = {5}, number = {1}, author = {Li, Jinghua and Li, Rui and Chiang, Chia‐Han and Zhong, Yishan and Shen, Haixu and Song, Enming and Hill, Mackenna and Won, Sang Min and Yu, Ki Jun and Baek, Janice Mihyun and Lee, Yujin and Viventi, Jonathan and Huang, Yonggang and Rogers, John A.}, }