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Title: Metal Capping Layer Effects on Electromigration Failure Phenomena of Plasma Etched Copper Lines
Award ID(s):
1633580
PAR ID:
10201081
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
ECS Journal of Solid State Science and Technology
Volume:
9
Issue:
10
ISSN:
2162-8777
Page Range / eLocation ID:
104009
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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