Coupling extraction and optimization for heterogeneous 2.5D chiplet-package co-design
- Award ID(s):
- 1755981
- PAR ID:
- 10207038
- Date Published:
- Journal Name:
- International Conference On Computer Aided Design (ICCAD)
- Page Range / eLocation ID:
- 1 to 8
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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