Guo, Yuandong, Kim, DongHyun, He, Jiayi, Yong, Shaohui, Liu, Yuanzhuo, Ye, Xiaoning, and Fan, Jun. Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines. Retrieved from https://par.nsf.gov/biblio/10213256. 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) . Web. doi:10.1109/EMCSI38923.2020.9191467.

Guo, Yuandong, Kim, DongHyun, He, Jiayi, Yong, Shaohui, Liu, Yuanzhuo, Ye, Xiaoning, & Fan, Jun. Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines. 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), (). Retrieved from https://par.nsf.gov/biblio/10213256. https://doi.org/10.1109/EMCSI38923.2020.9191467

Guo, Yuandong, Kim, DongHyun, He, Jiayi, Yong, Shaohui, Liu, Yuanzhuo, Ye, Xiaoning, and Fan, Jun. "Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines". 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (). Country unknown/Code not available. https://doi.org/10.1109/EMCSI38923.2020.9191467. https://par.nsf.gov/biblio/10213256.

@article{osti_10213256,
place = {Country unknown/Code not available}, title = {Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines}, url = {https://par.nsf.gov/biblio/10213256}, DOI = {10.1109/EMCSI38923.2020.9191467}, abstractNote = {}, journal = {2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)}, author = {Guo, Yuandong and Kim, DongHyun and He, Jiayi and Yong, Shaohui and Liu, Yuanzhuo and Ye, Xiaoning and Fan, Jun}, editor = {null} }