Ouyang, Muqi, Sun, Yin, Lee, Jongjoo, Kim, Jingook, and Hwang, Chulsoon. Mechanism Analysis on Radio Frequency Radiation in IC/Package with Bonding Wires. Retrieved from https://par.nsf.gov/biblio/10213265. 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) . Web. doi:10.1109/EMCSI38923.2020.9191486.

Ouyang, Muqi, Sun, Yin, Lee, Jongjoo, Kim, Jingook, & Hwang, Chulsoon. Mechanism Analysis on Radio Frequency Radiation in IC/Package with Bonding Wires. 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), (). Retrieved from https://par.nsf.gov/biblio/10213265. https://doi.org/10.1109/EMCSI38923.2020.9191486

Ouyang, Muqi, Sun, Yin, Lee, Jongjoo, Kim, Jingook, and Hwang, Chulsoon. "Mechanism Analysis on Radio Frequency Radiation in IC/Package with Bonding Wires". 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (). Country unknown/Code not available. https://doi.org/10.1109/EMCSI38923.2020.9191486. https://par.nsf.gov/biblio/10213265.

@article{osti_10213265,
place = {Country unknown/Code not available}, title = {Mechanism Analysis on Radio Frequency Radiation in IC/Package with Bonding Wires}, url = {https://par.nsf.gov/biblio/10213265}, DOI = {10.1109/EMCSI38923.2020.9191486}, abstractNote = {}, journal = {2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)}, author = {Ouyang, Muqi and Sun, Yin and Lee, Jongjoo and Kim, Jingook and Hwang, Chulsoon}, editor = {null} }