Thermal Analysis of a Skull Implant in Brain-Computer Interfaces
- Award ID(s):
- 1646275
- PAR ID:
- 10216639
- Date Published:
- Journal Name:
- 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
- Page Range / eLocation ID:
- 3066 to 3069
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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