Wilson, Caleb, Thompson, Lonny, Choi, Hongseok, and Bostwick, Joshua B. Enhanced wettability in ultrasonic-assisted soldering to glass substrates. Retrieved from https://par.nsf.gov/biblio/10219182. Journal of Manufacturing Processes 64.C Web. doi:10.1016/j.jmapro.2021.01.030.

Wilson, Caleb, Thompson, Lonny, Choi, Hongseok, & Bostwick, Joshua B. Enhanced wettability in ultrasonic-assisted soldering to glass substrates. Journal of Manufacturing Processes, 64 (C). Retrieved from https://par.nsf.gov/biblio/10219182. https://doi.org/10.1016/j.jmapro.2021.01.030

Wilson, Caleb, Thompson, Lonny, Choi, Hongseok, and Bostwick, Joshua B. "Enhanced wettability in ultrasonic-assisted soldering to glass substrates". Journal of Manufacturing Processes 64 (C). Country unknown/Code not available. https://doi.org/10.1016/j.jmapro.2021.01.030. https://par.nsf.gov/biblio/10219182.

@article{osti_10219182,
place = {Country unknown/Code not available}, title = {Enhanced wettability in ultrasonic-assisted soldering to glass substrates}, url = {https://par.nsf.gov/biblio/10219182}, DOI = {10.1016/j.jmapro.2021.01.030}, abstractNote = {}, journal = {Journal of Manufacturing Processes}, volume = {64}, number = {C}, author = {Wilson, Caleb and Thompson, Lonny and Choi, Hongseok and Bostwick, Joshua B.}, editor = {null} }