Ahmed, Omar, Jalilvand, Golareh, Okoro, Chukwudi, Pollard, Scott, and Jiang, Tengfei. Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias. Retrieved from https://par.nsf.gov/biblio/10220949. IEEE Transactions on Device and Materials Reliability 20.1 Web. doi:10.1109/TDMR.2020.2973940.

Ahmed, Omar, Jalilvand, Golareh, Okoro, Chukwudi, Pollard, Scott, & Jiang, Tengfei. Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias. IEEE Transactions on Device and Materials Reliability, 20 (1). Retrieved from https://par.nsf.gov/biblio/10220949. https://doi.org/10.1109/TDMR.2020.2973940

Ahmed, Omar, Jalilvand, Golareh, Okoro, Chukwudi, Pollard, Scott, and Jiang, Tengfei. "Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias". IEEE Transactions on Device and Materials Reliability 20 (1). Country unknown/Code not available. https://doi.org/10.1109/TDMR.2020.2973940. https://par.nsf.gov/biblio/10220949.

@article{osti_10220949,
place = {Country unknown/Code not available}, title = {Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias}, url = {https://par.nsf.gov/biblio/10220949}, DOI = {10.1109/TDMR.2020.2973940}, abstractNote = {}, journal = {IEEE Transactions on Device and Materials Reliability}, volume = {20}, number = {1}, author = {Ahmed, Omar and Jalilvand, Golareh and Okoro, Chukwudi and Pollard, Scott and Jiang, Tengfei}, editor = {null} }