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Title: Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design
Award ID(s):
1755981
PAR ID:
10232451
Author(s) / Creator(s):
;
Date Published:
Journal Name:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume:
11
Issue:
5
ISSN:
2156-3950
Page Range / eLocation ID:
715 to 726
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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