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Title: Enhancing the Reliability of MEDA Biochips Using IJTAG and Wear Leveling
Award ID(s):
1914796 1702596
PAR ID:
10249405
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ISSN:
0278-0070
Page Range / eLocation ID:
1 to 1
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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