skip to main content

Explore Research Products in the NSF-PAR

Title: Enhancing the Reliability of MEDA Biochips Using IJTAG and Wear Leveling
Award ID(s):
1914796 1702596
NSF-PAR ID:
10249405
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ISSN:
0278-0070
Page Range / eLocation ID:
1 to 1
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
More Like this
No document suggestions found
  • Citation Formats
  • MLA
  • APA
  • Chicago
  • BibTeX
  • Save / Share this Record
  • Send to Email