Thermal management is becoming a critical technology challenge for modern electronics with decreasing device size and increasing power density. One key materials innovation is the development of advanced thermal interfaces in electronic packaging to enable efficient heat dissipation and improve device performance, which has attracted intensive research efforts from both academia and industry over the past several decades. Here we review the recent progress in both theory and experiment for developing high-performance thermal interface materials. First, the basic theories and computational frameworks for interface energy transport are discussed, ranging from atomistic interface scattering to multiscale disorders that contributed to thermal boundary resistance. Second, state-of-the-art experimental techniques including steady-state and transient thermal measurements are discussed and compared. Moreover, the important structure design, requirements, and property factors for thermal interface materials depending on different applications are summarized and exemplified with the recent literature. Finally, emerging new semiconductors and polymers with high thermal conductivity are briefly reviewed and opportunities for future research are discussed.
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Recent advances in neural interfaces—Materials chemistry to clinical translation
Implantable neural interfaces are important tools to accelerate neuroscience research and translate clinical neurotechnologies. The promise of a bidirectional communication link between the nervous system of humans and computers is compelling, yet important materials challenges must be first addressed to improve the reliability of implantable neural interfaces. This perspective highlights recent progress and challenges related to arguably two of the most common failure modes for implantable neural interfaces: (1) compromised barrier layers and packaging leading to failure of electronic components; (2) encapsulation and rejection of the implant due to injurious tissue–biomaterials interactions, which erode the quality and bandwidth of signals across the biology–technology interface. Innovative materials and device design concepts could address these failure modes to improve device performance and broaden the translational prospects of neural interfaces. A brief overview of contemporary neural interfaces is presented and followed by recent progress in chemistry, materials, and fabrication techniques to improve in vivo reliability, including novel barrier materials and harmonizing the various incongruences of the tissue–device interface. Challenges and opportunities related to the clinical translation of neural interfaces are also discussed.
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- Award ID(s):
- 1943906
- NSF-PAR ID:
- 10250568
- Date Published:
- Journal Name:
- MRS Bulletin
- Volume:
- 45
- Issue:
- 8
- ISSN:
- 0883-7694
- Page Range / eLocation ID:
- 655 to 668
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1557/mrs.2020.195
