Thermal Simulation of a CPU Based on Model Order Reduction (Conference Paper) | NSF PAGES

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Citation Details

Thermal Simulation of a CPU Based on Model Order Reduction

Award ID(s):: 2003307

NSF-PAR ID:: 10251974

Author(s) / Creator(s):: Ruttan, K; Jiang, L.; Dowling, A.; Liu, Y.; Cheng, M.C.

Date Published:: 2020-10-01

Journal Name:: 2020 IEEE MIT Undergraduate Research Tech. Conference

Format(s):: Medium: X

Sponsoring Org:: National Science Foundation

Free Publicly Accessible Full Text
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Conference Paper:
The DOI is not currently available.