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Title: Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design
Award ID(s):
1755981
PAR ID:
10253630
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Great Lakes Symposium on VLSI
Page Range / eLocation ID:
135 to 140
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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