Ultrafast assembly and healing of nanomaterial networks on polymer substrates for flexible hybrid electronics
- Award ID(s):
- 2003077
- NSF-PAR ID:
- 10257070
- Date Published:
- Journal Name:
- Applied Materials Today
- Volume:
- 22
- Issue:
- C
- ISSN:
- 2352-9407
- Page Range / eLocation ID:
- 100956
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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