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Title: Ultrafast assembly and healing of nanomaterial networks on polymer substrates for flexible hybrid electronics
Award ID(s):
2003077
NSF-PAR ID:
10257070
Author(s) / Creator(s):
; ; ; ; ;
Date Published:
Journal Name:
Applied Materials Today
Volume:
22
Issue:
C
ISSN:
2352-9407
Page Range / eLocation ID:
100956
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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