Tan, Sheldon, Sun, Zeyu, and Sadiqbatcha, Sheriff. Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. Retrieved from https://par.nsf.gov/biblio/10279534. IPSJ Transactions on System LSI Design Methodology 13.0 Web. doi:10.2197/ipsjtsldm.13.42.

Tan, Sheldon, Sun, Zeyu, & Sadiqbatcha, Sheriff. Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Transactions on System LSI Design Methodology, 13 (0). Retrieved from https://par.nsf.gov/biblio/10279534. https://doi.org/10.2197/ipsjtsldm.13.42

Tan, Sheldon, Sun, Zeyu, and Sadiqbatcha, Sheriff. "Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip". IPSJ Transactions on System LSI Design Methodology 13 (0). Country unknown/Code not available. https://doi.org/10.2197/ipsjtsldm.13.42. https://par.nsf.gov/biblio/10279534.

@article{osti_10279534,
place = {Country unknown/Code not available}, title = {Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip}, url = {https://par.nsf.gov/biblio/10279534}, DOI = {10.2197/ipsjtsldm.13.42}, abstractNote = {}, journal = {IPSJ Transactions on System LSI Design Methodology}, volume = {13}, number = {0}, author = {Tan, Sheldon and Sun, Zeyu and Sadiqbatcha, Sheriff}, editor = {null} }