Gavrilin, Andrew, Kolb-Bond, Dylan, Kim, Kwang Lok, Kim, Kwangmin, Marshall, William, and Dixon, Iain. Quench and Stability Modelling of a Metal-Insulation Multi-Double-Pancake High-Temperature-Superconducting Coil. Retrieved from https://par.nsf.gov/biblio/10302637. IEEE Transactions on Applied Superconductivity 31.5 Web. doi:10.1109/TASC.2021.3066548.

Gavrilin, Andrew, Kolb-Bond, Dylan, Kim, Kwang Lok, Kim, Kwangmin, Marshall, William, & Dixon, Iain. Quench and Stability Modelling of a Metal-Insulation Multi-Double-Pancake High-Temperature-Superconducting Coil. IEEE Transactions on Applied Superconductivity, 31 (5). Retrieved from https://par.nsf.gov/biblio/10302637. https://doi.org/10.1109/TASC.2021.3066548

Gavrilin, Andrew, Kolb-Bond, Dylan, Kim, Kwang Lok, Kim, Kwangmin, Marshall, William, and Dixon, Iain. "Quench and Stability Modelling of a Metal-Insulation Multi-Double-Pancake High-Temperature-Superconducting Coil". IEEE Transactions on Applied Superconductivity 31 (5). Country unknown/Code not available. https://doi.org/10.1109/TASC.2021.3066548. https://par.nsf.gov/biblio/10302637.

@article{osti_10302637,
place = {Country unknown/Code not available}, title = {Quench and Stability Modelling of a Metal-Insulation Multi-Double-Pancake High-Temperature-Superconducting Coil}, url = {https://par.nsf.gov/biblio/10302637}, DOI = {10.1109/TASC.2021.3066548}, abstractNote = {}, journal = {IEEE Transactions on Applied Superconductivity}, volume = {31}, number = {5}, author = {Gavrilin, Andrew and Kolb-Bond, Dylan and Kim, Kwang Lok and Kim, Kwangmin and Marshall, William and Dixon, Iain}, }