Electrodeposition of Cu(111) onto a Ru(0001) seed layer for epitaxial Cu interconnects
- Award ID(s):
- 1740270
- NSF-PAR ID:
- 10305958
- Publisher / Repository:
- American Institute of Physics
- Date Published:
- Journal Name:
- Journal of Applied Physics
- Volume:
- 130
- Issue:
- 13
- ISSN:
- 0021-8979
- Page Range / eLocation ID:
- Article No. 135301
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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