Interfacial delamination and delamination mechanism maps for 3D printed flexible electrical interconnects
- Award ID(s):
- 1757117
- PAR ID:
- 10309278
- Date Published:
- Journal Name:
- Extreme Mechanics Letters
- Volume:
- 43
- Issue:
- C
- ISSN:
- 2352-4316
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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