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Title: Accelerated mechanical low cycle fatigue in isothermal solder interconnects
Award ID(s):
1725925
PAR ID:
10310040
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Microelectronics Reliability
Volume:
116
Issue:
C
ISSN:
0026-2714
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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