Abstract Roll-to-roll (R2R) dry transfer is an important process for manufacturing of large-scale two-dimensional (2D) materials and printed flexible electronics. Existing research has demonstrated the feasibility of dry transfer of 2D materials in a roll-to-roll setting with mechanical peeling. However, the process presents a significant challenge to system control due to the lack of understanding of the mechanical peeling behavior and the complexity of the nonlinear system dynamics. In this study, an R2R peeling process model is developed to understand the dynamic interaction among the peeling process parameters, including adhesion energy, peeling force, angle, and speed. Both simulation and experimental studies are conducted to validate the model. It is shown that the dynamic system model can capture the transient behavior of the R2R mechanical peeling process and be used for the process analysis and control design.
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Tension Control in Roll-to-Roll Mechanical Peeling for 2D Material Transfer and Transfer Printing
A major challenge of the large-scale application of two-dimensional (2D) materials is the scaling up of the process for its growth and transfer. Mechanical peeling has been demonstrated to be a promising method for transferring graphene in a fast and environmentally friendly manner. However, efforts in scaling up the process have been lacking. Performing mechanical peeling using a roll-to-roll (R2R) system could significantly increase the throughput of graphene transfer. Such a R2R process does not exist in industry. In this paper a novel R2R mechanical peeling system that has both speed and tension control capabilities is presented. Controllers that control the peeling tensions on both sides of the peeling front are developed based on a tension dynamics model. Both controllers contain a feedback and a feedforward term to account for large steady-state error. The control performance is validated using both experiments and simulation, demonstrating that the R2R mechanical peeling technique can be a viable method for dry transfer of 2D materials in a high-throughput industrial setting.
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- Award ID(s):
- 2041470
- NSF-PAR ID:
- 10311116
- Editor(s):
- Sreenivasan, S.V.
- Date Published:
- Journal Name:
- 2021 International Conference on Micro- and Nano-devices Enabled by R2R Manufacturing
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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