Shaffer Brown, Jennifer, Wilson, Caleb, Bohlen, Charles, Choi, Hongseok, Thompson, Lonny, and Bostwick, Joshua B. Failure modes and bonding strength of ultrasonically-soldered glass joints. Retrieved from https://par.nsf.gov/biblio/10311628. Journal of Materials Processing Technology 299.C Web. doi:10.1016/j.jmatprotec.2021.117385.

Shaffer Brown, Jennifer, Wilson, Caleb, Bohlen, Charles, Choi, Hongseok, Thompson, Lonny, & Bostwick, Joshua B. Failure modes and bonding strength of ultrasonically-soldered glass joints. Journal of Materials Processing Technology, 299 (C). Retrieved from https://par.nsf.gov/biblio/10311628. https://doi.org/10.1016/j.jmatprotec.2021.117385

Shaffer Brown, Jennifer, Wilson, Caleb, Bohlen, Charles, Choi, Hongseok, Thompson, Lonny, and Bostwick, Joshua B. "Failure modes and bonding strength of ultrasonically-soldered glass joints". Journal of Materials Processing Technology 299 (C). Country unknown/Code not available. https://doi.org/10.1016/j.jmatprotec.2021.117385. https://par.nsf.gov/biblio/10311628.

@article{osti_10311628,
place = {Country unknown/Code not available}, title = {Failure modes and bonding strength of ultrasonically-soldered glass joints}, url = {https://par.nsf.gov/biblio/10311628}, DOI = {10.1016/j.jmatprotec.2021.117385}, abstractNote = {}, journal = {Journal of Materials Processing Technology}, volume = {299}, number = {C}, author = {Shaffer Brown, Jennifer and Wilson, Caleb and Bohlen, Charles and Choi, Hongseok and Thompson, Lonny and Bostwick, Joshua B.}, }