Hunter, James, Xia, Shengxuan, Harmon, Aaron, Hassan, Ahmed, Khilkevich, Victor, and Beetner, Daryl. Modeling and Statistical Characterization of Electromagnetic Coupling to Electronic Devices. Retrieved from https://par.nsf.gov/biblio/10313037. 2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) . Web. doi:10.23919/USNC-URSINRSM51531.2021.9336496.

Hunter, James, Xia, Shengxuan, Harmon, Aaron, Hassan, Ahmed, Khilkevich, Victor, & Beetner, Daryl. Modeling and Statistical Characterization of Electromagnetic Coupling to Electronic Devices. 2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), (). Retrieved from https://par.nsf.gov/biblio/10313037. https://doi.org/10.23919/USNC-URSINRSM51531.2021.9336496

Hunter, James, Xia, Shengxuan, Harmon, Aaron, Hassan, Ahmed, Khilkevich, Victor, and Beetner, Daryl. "Modeling and Statistical Characterization of Electromagnetic Coupling to Electronic Devices". 2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (). Country unknown/Code not available. https://doi.org/10.23919/USNC-URSINRSM51531.2021.9336496. https://par.nsf.gov/biblio/10313037.

@article{osti_10313037,
place = {Country unknown/Code not available}, title = {Modeling and Statistical Characterization of Electromagnetic Coupling to Electronic Devices}, url = {https://par.nsf.gov/biblio/10313037}, DOI = {10.23919/USNC-URSINRSM51531.2021.9336496}, abstractNote = {}, journal = {2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)}, author = {Hunter, James and Xia, Shengxuan and Harmon, Aaron and Hassan, Ahmed and Khilkevich, Victor and Beetner, Daryl}, }