A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5D Chiplet-Package Co-Optimization
- Award ID(s):
- 1755981
- PAR ID:
- 10319476
- Date Published:
- Journal Name:
- IEEE Conference on Electrical Performance of Electronic Packaging and Systems
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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