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1. Genome Sequence and Assembly of 18 Fusarium Isolates from Florida Citrus under High Huanglongbing Disease Pressure and California Citrus under Low Huanglongbing Disease Pressure

   https://doi.org/10.1128/mra.00101-23  

   Kurbessoian, Tania ; Heimlich-Villalta, Gretchen ; Ginnan, Nichole ; Vieira, Flavia Campos ; Rolshausen, Philippe E. ; Roper, M. Caroline ; Stajich, Jason E. ( May 2023 , Microbiology Resource Announcements)

   Rokas, Antonis (Ed.)

   ABSTRACT The genomes of eighteen Fusarium isolates cultured from diseased and healthy citrus trees were sequenced, assembled, and annotated. Isolate species identification was confirmed using single marker (TEF1-alpha) phylogenetic assessment. Studies of the traits and genotypes of plant-associated isolates are important to understanding the fungal contribution to phytobiomes of citrus. 

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2. Are p -values under attack? Contribution to the discussion of ‘A critical evaluation of the current “ p -value controversy” ’: Are p -value under attack?

   https://doi.org/10.1002/bimj.201700031  

   Piegorsch, Walter W. ( September 2017 , Biometrical Journal)
3. Ag–TiO 2 Hybrid Nanocrystal Photocatalyst: Hydrogen Evolution under UV Irradiation but Not under Visible-Light Irradiation

   https://doi.org/10.1021/acsaem.9b01730  

   Varapragasam, Shelton J. ; Mia, Shahzahan ; Wieting, Carly ; Balasanthiran, Choumini ; Hossan, Md Yeathad ; Baride, Aravind ; Rioux, Robert M. ; Hoefelmeyer, James D. ( October 2019 , ACS Applied Energy Materials)

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4. Viscoelastic Influence On the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

   https://doi.org/10.1115/1.4054784  

   Misrak, Abel ; Bhandari, Rabin ; Agonafer, Dereje ( June 2022 , Journal of Electronic Packaging)

   Abstract Structural components such as printed circuit boards (PCBs) are critical in the thermomechanical reliability assessment of electronic packages. Previous studies have shown that geometric parameters such as thickness and mechanical properties like elastic modulus of PCBs have direct influence on the reliability of electronic packages. Elastic material properties of PCBs are commonly characterized using equipment such as tensile testers and used in computational studies. However, in certain applications viscoelastic material properties are important. Viscoelastic influence on materials is evident when one exceeds the glass transition temperature of materials. Operating conditions or manufacturing conditions such as lamination and soldering may expose components to temperatures that exceed the glass transition temperatures. Knowing the viscoelastic behavior of the different components of electronic packages is important in order to perform accurate reliability assessment and design components such as printed circuit boards (PCBs) that will remain dimensionally stable after the manufacturing process. Previous researchers have used creep and stress relaxation test data to obtain the Prony series terms that represent the viscoelastic behavior and perform analysis. Others have used dynamic mechanical analysis in order to obtain frequency domain master curves that were converted to time domain before obtaining the Prony series terms. In this paper, nonlinear solvers were used on frequency domain master curve results from dynamic mechanical analysis to obtain Prony series terms and perform finite element analysis on the impact of adding viscoelastic properties when performing reliability assessment. The computational study results were used to perform comparative assessment to understand the impact of including viscoelastic behavior in reliability analysis under thermal cycling and drop testing for Wafer Level Chip Scale Packages. 

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5. Thriving Under Stress: Pseudomonas aeruginosa Outcompetes the Background Polymicrobial Community Under Treatment Conditions in a Novel Chronic Wound Model

   https://doi.org/10.3389/fcimb.2020.569685  

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