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Title: Elucidating the Role of Hydrogen Bonds for Improved Mechanical Properties in a High-Performance Semiconducting Polymer
Award ID(s):
2047689
NSF-PAR ID:
10320456
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
Chemistry of Materials
Volume:
34
Issue:
5
ISSN:
0897-4756
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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