Electrochemical additive manufacturing of NiCoFeCuMo high entropy alloys using a combined dissolution-deposition system
- Award ID(s):
- 1955842
- PAR ID:
- 10330338
- Date Published:
- Journal Name:
- CIRP Annals
- ISSN:
- 0007-8506
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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