Droplet Evaporation on Hot Micro-Structured Superhydrophobic Surfaces: Analysis of Evaporation from Droplet Cap and Base Surfaces

Huang, Wenge; He, Xukun; Liu, Cong; Li, Xiaojie; Liu, Yahua; Collier, C. Patrick; Srijanto, Bernadeta R.; Liu, Jiansheng; Cheng, Jiangtao

doi:10.1016/j.ijheatmasstransfer.2021.122314

The evaporation of droplets on surfaces is a ubiquitous phenomenon essential in nature and industrial applications ranging from thermal management of electronics to self-assembly-based fabrication. In this study, water droplet evaporation on a thin quartz substrate is analyzed using an unsteady two-step arbitrary Lagrangian-Eulerian (ALE) moving mesh model, wherein the evaporation process is simulated during the constant contact radius (CCR) and contact angle (CCA) modes. The numerical model considers mass transfer in the gas domain, flow in the liquid and gas domains, and heat transfer in the solid, liquid, and gas domains. Besides, the model also accounts for interfacial force balance, including thermocapillary stresses, to obtain the instantaneous droplet shape. Experiments involving droplet evaporation on unheated quartz substrates agree with model predictions of contact radius, contact angle, and droplet volume. Model results indicating temperature and velocity distribution across an evaporating water droplet show that the lowest temperatures are at the liquid-gas interface, and a single vortex exists for the predominant duration of the droplet's lifetime. The temperature of the unheated substrate is also significantly reduced due to evaporative cooling. The interfacial evaporation flux distribution, which depends on heat transfer across the droplet and advection in the surrounding medium, shows the highest values near the three-phase contact line. In addition, the model also predicts evaporation dynamics when the substrate is heated and exposed to different advection conditions. Generally, higher evaporation rates result from higher substrate heating and advection rates. However, substrate heating and advection in the surrounding gas have minimal effects on the relative durations of CCR and CCA modes for a given receding contact angle. Specifically, in this case, a 40× increase in substrate heating rate or 7.5× increase in gas velocity can only change these relative durations by 3%. This study also highlights the importance of surface wettability, which affects evaporation dynamics for all the conditions explored by the numerical model.

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