Zareei, Amin, Gopalakrishnan, Sarath, Mutlu, Zeynep, He, Zihao, Peana, Samuel, Wang, Haiyan, and Rahimi, Rahim. Highly Conductive Copper–Silver Bimodal Paste for Low-Cost Printed Electronics. Retrieved from https://par.nsf.gov/biblio/10341587. ACS Applied Electronic Materials 3.8 Web. doi:10.1021/acsaelm.1c00345.

Zareei, Amin, Gopalakrishnan, Sarath, Mutlu, Zeynep, He, Zihao, Peana, Samuel, Wang, Haiyan, & Rahimi, Rahim. Highly Conductive Copper–Silver Bimodal Paste for Low-Cost Printed Electronics. ACS Applied Electronic Materials, 3 (8). Retrieved from https://par.nsf.gov/biblio/10341587. https://doi.org/10.1021/acsaelm.1c00345

Zareei, Amin, Gopalakrishnan, Sarath, Mutlu, Zeynep, He, Zihao, Peana, Samuel, Wang, Haiyan, and Rahimi, Rahim. "Highly Conductive Copper–Silver Bimodal Paste for Low-Cost Printed Electronics". ACS Applied Electronic Materials 3 (8). Country unknown/Code not available. https://doi.org/10.1021/acsaelm.1c00345. https://par.nsf.gov/biblio/10341587.

@article{osti_10341587,
place = {Country unknown/Code not available}, title = {Highly Conductive Copper–Silver Bimodal Paste for Low-Cost Printed Electronics}, url = {https://par.nsf.gov/biblio/10341587}, DOI = {10.1021/acsaelm.1c00345}, abstractNote = {}, journal = {ACS Applied Electronic Materials}, volume = {3}, number = {8}, author = {Zareei, Amin and Gopalakrishnan, Sarath and Mutlu, Zeynep and He, Zihao and Peana, Samuel and Wang, Haiyan and Rahimi, Rahim}, }